Led module

ABSTRACT

A lead  1  includes a die-bonding portion  11  with an opening  11   a  penetrating in a thickness direction. Another lead  2  is spaced from the lead  1.  An LED unit  3  includes an LED chip  30  with a electrode terminal  31  connected to the lead  1  and another electrode terminal  32  connected to the lead  2.  The LED unit  3,  mounted on a surface of the die-bonding portion  11  on a first side in z direction, overlaps the opening  11   a . A wire  52  connects the lead  2  and the electrode terminal  32.  A support member  4  supporting the leads  1 - 2  is held in contact with another surface of the die-bonding portion  11  on a second side in z direction. These arrangements ensure efficient heat dissipation from the LED chip  30  and efficient use of light emitted from the LED chip  3.

This application is a Continuation of U.S. Ser. No. 13/695,206 filedOct. 29, 2012, which is a National Stage Application ofPCT/JP2011/060436, filed Apr. 28, 2011, which applications areincorporated herein by reference.

TECHNICAL FIELD

The present invention relates to an LED module incorporating an LEDchip.

BACKGROUND ART

FIG. 12 shows an example of conventional LED module (see Patent Document1, for example). In the LED module X shown in FIG. 12, an LED unit 92 ismounted at the center on an obverse surface of a substrate 91 by using abonding material, not shown. The substrate 91 is an insulating substratemade of a ceramic material such as alumina or alumina nitride. The LEDunit 92 is connected to leads 94 and 95 by wires 93. The LED module Xfurther includes a resin cover 96 made of a transparent epoxy resin andcovering the LED unit 92 and the wires 93. For instance, the LED unit 92is made transparent.

In the LED module X, the obverse surface of the substrate 91 is madewhite so that light traveling through the reverse surface of the LEDunit 92 toward the obverse surface of the substrate 91 is reflected.This assures that light emitted from the LED unit 92 is efficientlyutilized.

However, when the LED unit 92 is directly mounted on the substrate 91,heat generated during light emission of the LED unit 92 is not easilydissipated as compared with the case where the LED unit 92 is mounted ona wiring pattern made of a metal, for example. On the other hand,although a wiring pattern made of a metal is an excellent heatdissipator, its surface may change to a dark color as time elapses. Suchcolor change hinders efficient

-   utilization of light from the LED unit 92.

TECHNICAL REFERENCE Paten Document

Patent Document 1: JP-A-11-112025

SUMMARY OF THE INVENTION Problems to be Solved by the Invention

The present invention has been conceived under the circumstancesdescribed above. It is therefore an object of the present invention toprovide an LED module that can efficiently dissipate heat from the LEDchip incorporated in it and efficiently utilize light emitted from theLED chip.

Means for Solving the Problems

According to a first aspect of the present invention, there is providedan LED module comprising: a first lead including a die-bonding portionformed with an opening penetrating in a thickness direction; a secondlead spaced apart from the first lead; an LED unit including an LED chipprovided with a first electrode terminal and a second electrodeterminal, the first electrode terminal being electrically connected tothe first lead, the second electrode terminal being electricallyconnected to the second lead, the LED unit being mounted on a surface ofthe die-bonding portion on a first side in the thickness direction in amanner overlapping the opening at least partially; a wire connecting thesecond lead and the second electrode terminal to each other; and asupport member supporting the first and the second leads and held incontact with a surface of the die-bonding portion on a second side inthe thickness direction.

According to this arrangement, heat generated during light emission ofthe light-emitting element is readily transferred to the die-bondingportion and released to the outside through the first lead. Further,part of the light emitted from the light-emitting element toward thedie-bonding portion side in the thickness direction is reflected by thewhite support member filling the opening. Thus, the light-emittingelement module of the present invention exhibits both high heatdissipation and high brightness.

According to a second aspect of the present invention, in the LED moduleof the first aspect, at least part of the opening overlaps a part of theLED chip as viewed in the thickness direction.

According to a third aspect of the present invention, in the LED moduleof the first or second aspect, the support member is made of a whiteresin.

According to a fourth aspect of the present invention, in the LED moduleof the third aspect, the opening is filled with a part of the supportmember.

According to a fifth aspect of the present invention, in the LED moduleof any one of the second through the fourth aspects, the opening issmaller than the LED chip as viewed in the thickness direction, and theentirety of the opening is included in the LED chip.

According to a sixth aspect of the present invention, in the LED moduleof any one of the second through the fourth aspects, the openingincludes a portion that does not overlap the LED chip as viewed in thethickness direction.

According to a seventh aspect of the present invention, in the LEDmodule of the sixth aspect, the first and the second electrode terminalsare provided on an end surface of the LED chip disposed on the firstside in the thickness direction, and the opening includes an edgedisposed on a side in a direction perpendicular to a direction in whichthe wire extends, where the edge of the opening is arranged not tooverlap the LED chip as viewed in the thickness direction.

According to an eighth aspect of the present invention, in the LEDmodule of the fifth or sixth aspect, the second electrode terminal isprovided on a first end surface of the LED chip in the thicknessdirection, and the first electrode terminal is provided on a second endsurface of the LED chip in the thickness direction.

Other features and advantages of the present invention will become moreapparent from detailed description given below with reference to theaccompanying drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a plan view showing an LED module according to a firstembodiment of the present invention;

FIG. 2 is a sectional view taken along lines II-II in FIG. 1;

FIG. 3 is a graph showing the relationship between the performance andthe area of an opening of the LED module shown in FIG. 1;

FIG. 4 is an enlarged plan view showing a principal portion of anotherexample of the LED module shown in FIG. 1;

FIG. 5 is a plan view showing an LED module according to a secondembodiment of the present invention;

FIG. 6 is a plan view showing an LED module according to a thirdembodiment of the present invention;

FIG. 7 is a plan view showing an LED module according to a fourthembodiment of the present invention;

FIG. 8 is a sectional view taken along lines VIII-VIII in FIG. 7;

FIG. 9 is a plan view showing an LED module according to a fifthembodiment of the present invention;

FIG. 10 is a sectional view taken along lines X-X in FIG. 9;

FIG. 11 is a sectional view showing an LED module according to a sixthembodiment the present invention; and

FIG. 12 is a perspective view showing a conventional

LED module.

MODE FOR CARRYING OUT THE INVENTION

Preferred embodiments of the present invention are described below withreference to the accompanying drawings.

FIGS. 1 and 2 show an LED module according to a first embodiment of thepresent invention. The LED module A1 of this embodiment includes a lead1, a lead 2 spaced apart from the lead 1, and an LED unit 3 electricallyconnected to each of the leads 1 and 2, and is designed such that theLED chip 3 emits light due to connection of the leads 1 and 2 to anexternal electric circuit. The LED unit 3 is connected to the lead 1 bya wire 51 and connected to the lead 2 by a wire 52. The LED module A1further includes a support member 6 for fixing the leads 1 and 2, and aprotective member 7 for protecting the LED unit 3. In FIG. 1,illustration of the protective member 7 is omitted. The LED module A1 isin the form of an elongated rectangle with a longer side extending inthe x direction and a shorter side extending in the y direction, asviewed in the z direction.

The lead 1 includes a die-bonding portion 11 having an opening 11 a, anda terminal portion 12 extending from the die-bonding portion 11. Thelead 1 is made by punching a copper plate which is 0.15 to 0.20 mm inthickness to form an opening 11 a, and then plating the surface withsilver.

The die-bonding portion 11 is a portion for mounting the LED unit 3. Theopening 11 a is provided adjacent to the center of the die-bondingportion 11 in the y direction. The position, shape and size of theopening 11 a can be set appropriately in the punching process. Theopening 11 a in this embodiment is in the form of a rectangle having adimension of 0.3 mm in the x direction and a dimension of 0.2 mm in they direction. As shown in FIG. 2, the opening 11 a is filled with thesupport member 6.

The terminal portion 12 is exposed to the outside from one end of thesupport member 6 in the x direction and is used to connect the lead 1 toan external electric circuit. The terminal portion 12 is formed bybending a portion of the lead 1 which projects from the support member 6after the support member 6 is formed.

As shown in FIGS. 1 and 2, the lead 2 includes a wire-bonding port ion21 spaced apart from the die-bonding portion 11 in the x direction, anda terminal portion 22 extending from the wire-bonding portion 21. Thelead 2 is formed by e.g. plating a copper plate which is 0.15 to 0.20 mmin thickness with silver. The terminal portion 22 is exposed to theoutside from another end of the support member 6 in the x direction andis used to connect the lead 2 to an external electric circuit. Theterminal portion 22 is formed by bending a portion of the lead 2 whichprojects from the support member 6 after the support member 6 is formed.

The LED unit 3 comprises an LED chip 30 made by forming a layer of asemiconductor material such as gallium nitride on a surface of asubstrate made of e.g. sapphire (Al2O3 single crystal). The LED chip 30emits blue light, green light, red light or the like due torecombination of electrons and holes in an active layer sandwichedbetween an n-type semiconductor layer and a p-type semiconductor layer.Since the light emitted is hardly absorbed by the sapphire substrate inthe LED unit 3, the light is emitted in almost all directions. As viewedin the z direction, the LED unit 3 is in the form of an elongatedrectangle having a dimension of 0.8 mm in the x direction and adimension of 0.4 mm in the y direction. As shown in FIG. 1, the LED unit3 is bonded to the die-bonding portion 11 by using a bonding material 4so as to overlap the opening 11 a as viewed in the z direction. In thisembodiment, the LED unit 3 is arranged to close the opening 11 a. Thebonding material 4 is e.g. a transparent epoxy resin.

To fix the LED unit 3 to the die-bonding portion 11, a bonding material4 is first applied to a region of the die-bonding portion 11 on whichthe LED unit 3 is to be mounted, and then the LED unit 3 is placed onthe bonding material 4.

The LED unit 3 has, on the upper end surface in the z direction, anelectrode terminal 31 at one end in the x direction and an electrodeterminal 32 at another end in the x direction. The electrode terminal 31is connected to an n-type semiconductor layer and electrically connectedto the die-bonding portion 11 via a wire 51. The electrode terminal 32is connected to a p-type semiconductor layer and electrically connectedto the wire-bonding portion 21 via a wire 52. The wires 51 and 52 may begold wires.

The support member 6 is made of a white epoxy resin in which e.g.titanium oxide is mixed and has a generally rectangular shape in planview, as shown in FIG. 1. The support member 6 fixes the leads 1 and 2by covering part of each lead. The support member 6 is recessed at thecenter and has a reflective surface 61 that is inclined to becomefurther away from the LED unit 3 in the x direction as proceeding upwardin the z direction. As shown in FIG. 1, the reflective surface 61 is inthe form of a frame surrounding the LED unit 3, as viewed in the zdirection. The reflective surface 61 serves to reflect the light emittedfrom the LED unit 3 in a direction perpendicular to the z directionupward in the z direction. The support member 6 having theabove-described structure is made by insert molding using a mold.Specifically, the support member 6 is formed by setting the leads 1 and2 in a mold, pouring liquid epoxy resin into the mold and then hardeningthe resin. According to this method, liquid epoxy resin flows into theopening 11 a, so that the opening 11 a is filled with part of thesupport member 6. When epoxy resin does not flow into the entire portionof the opening 11 a and only part of opening 11 a is filled with thesupport member 6, transparent bonding material 4 may be supplied intothe opening 11 a.

The protective member 7 is formed to fill the region surrounded by thereflective surface 61 and covers the die-bonding portion 11, thewire-bonding portion 21, the LED unit 3 and the wires 51, 52. Forinstance, the protective member 7 is made of a transparent epoxy resin.

The advantages of the LED module Al are described below.

According to this embodiment, since the LED unit 3 is mounted on thelead 1 made of a metal, heat generated during light emission of the LEDunit 3 is readily transferred to the lead 1. Since the terminal portion12 of the lead 1 is exposed to the outside of the support member 6, heattransferred to the lead 1 is readily released to the outside air. Thus,the LED module A1 exhibits high heat dissipation performance, and hencedeterioration of the LED unit 3 due to temperature rise is prevented,thereby providing enhanced reliability.

Moreover, according to this embodiment, part of the light emitted fromthe LED unit 3 downward in the z direction is reflected by the whitesupport member 6 filling the opening 11 a to travel upward in the zdirection. In this way, the presence of the white support member 6 underthe LED unit 3 provides a higher reflectivity than when the underside ofLED unit 3 is entirely covered by the lead 1 made of a metal. Thus, inthe LED module A1, light traveling downward in the z direction isefficiently turned into light traveling upward in the z direction. Thus,the LED module A1 can utilize light from the LED unit 3 with a highefficiency close to the efficiency provided when the LED unit 3 isplaced on a white non-metal material, while having high heat dissipationperformance due to the use of the metal lead 1.

FIG. 3 shows the relationship between the area of the opening 11 a asviewed in the z direction and the heat dissipation performance of theLED module A1 or use efficiency of the light emitted from the LED unit3. As shown in FIG. 3, as the area of the opening 11 a increases, theuse efficiency of light from the LED unit 3 increases, while the heatdissipation performance of the LED module A1 reduces. The area of theopening 11 a as viewed in the z direction is determined according to theapplication of the LED module A1 or the performance of the LED unit 3.In an example in which the area of the opening 11 a is smallest, theopening 11 a is in the form of a square as viewed in the z direction,with each side of the square corresponding to the thickness of the lead1. In an example in which the area of the opening 11 a is largest, theopening 11 a just overlaps the LED unit 3 in the z direction.

The opening 11 a may be divided e.g. as shown in FIG. 4. Moreover, theopening 11 a may not be merely divided but may comprise combination of aplurality of through-holes.

Other embodiments of the present invention are described below. In thesefigures, the elements that are identical or similar to those of theforegoing embodiment are designated by the same reference signs as thoseused for the foregoing embodiment, and the description is omittedappropriately.

FIG. 5 shows an LED module A2 according to a second embodiment of thepresent invention. The LED module A2 has a die-bonding portion 11 formedwith an opening 11 b larger than the opening 11 a of the foregoingembodiment. The structures of other parts are the same as those of theLED module A1.

The opening 11 b is in the form of a rectangle whose dimension in the ydirection is larger than the dimension in the y direction of the LEDunit 3. As shown in FIG. 5, in the y direction, the LED unit 3 isflanked by two edges of the opening 11 b which are spaced from eachother in the y direction. Similarly to the opening 11 a, the opening 11b is filled with the support member 6.

In this embodiment, heat generated during light emission of the LED unit3 is transferred to the die-bonding portion 11 from the two ends of theLED unit 3 which are spaced from each other in the x direction. Thus,the LED module A2 exhibits high heat dissipation performance.

At the two ends of the LED unit 3 which are spaced from each other inthe x direction are arranged the electrode terminals 31 and 32.Therefore, from these end portions, light is unlikely to be emittedupward in the z direction. In this embodiment, the underside of the LEDunit 3 in the z direction is white almost entirely except theabove-described portions from which light is unlikely to be emittedupward in the z direction. Thus, in the LED module A2, light emittedfrom the LED unit 3 downward in the z direction is turned into lighttraveling upward in the z direction with an efficiency close to theefficiency provided when the LED unit 92 is placed on a white substrate91, as is in the conventional LED module X. Thus, the LED module A2 canutilize light from the LED unit 3 with high efficiency, while retaininghigh heat dissipation performance.

FIG. 6 shows an LED module A3 according to a third embodiment of thepresent invention. The LED module A3 has a die-bonding portion 11 formedwith an opening 11 c in the form of a cutout. The structures of otherparts are the same as those of the LED module A1.

The opening 11 c extends downward from the upper edge of the die-bondingportion 11 in the y direction in FIG. 6. The opening 11 c is also filledwith the support member 6.

The LED module A3 also exhibits high heat dissipation performancebecause part of the LED unit 3 is held in contact with the die-bondingportion 11 made of a metal. Further, the white support member 6 fillingthe opening 11 c functions to efficiently turn the light emitted fromthe LED unit 3 downward in the z direction to light traveling upward inthe z direction.

FIGS. 7 and 8 show an LED module A4 according to a fourth embodiment ofthe present invention. The LED module A4 includes leads 1A, 1B, 1C, 2A,2B and 2C, LED units 3A, 3B and 3C, a support member 6, a protectivemember 7, and two Zener diodes 8. The LED module A4 is configured as aside-view LED module that emits light mainly in the z direction.

The leads 1A, 1B, 1C, 2A, 2B and 2C are made of copper and plated withsilver, for example.

The lead 1A includes a die-bonding portion 11, terminal portions 12, anda thin, elongated strip portion 13 connecting the die-bonding portion 11and the terminal portion 12 to each other. The die-bonding portion 11has an opening lid, and the LED unit 3A is bonded to the die-bondingportion by using a bonding material, not shown. The opening lid isfilled with the support member 6.

The LED unit 3A has an electrode terminal 31 at an end surface in the zdirection in FIG. 8 and an electrode terminal 32 at another end surfacein the z direction in FIG. 8. The electrode terminal 31 is electricallyconnected to the lead 1A by its contact with the die-bonding portion 11.The electrode terminal 32 is connected to the wire-bonding portion 21 ofthe lead 2A by a wire 53.

In this embodiment, as shown in FIG. 8, the opening lid is formed insuch a manner as to avoid the electrode terminal 31.

The LED units 3B and 3C mounted on the leads 1B and 1C have the samestructure as that of the LED unit 3 of the LED module A1. The LED unit3B is connected to the lead 1B via a wire 51 and connected to the lead2B via a wire 52. The LED unit 3C is connected to the lead 1C via a wire51 and connected to the lead 2C via a wire 52.

The die-bonding portion 11 of each of the leads 1B and 1C has an opening11 a similar to the opening provided in the LED module A1, for example.

In this embodiment, all the terminal portions 12, 22 of the leads 1A,1B, 1C, 2A, 2B and 2C are exposed to the outside of the support member 6from the lower side in the y direction in FIG. 7.

The two Zener diodes 8 are mounted on the leads 2B and 2C, respectively,and connected to the leads 1B and 1C via wires 54 and 55. The Zenerdiodes 8 prevent application of excessive reverse voltage to the LEDunits 3B and 3C and allow current to flow in a reverse direction onlywhen an excessive reverse voltage above a certain value is applied.

The LED module A4 also exhibits high heat dissipation performancebecause the LED units 3A, 3B and 3C are mounted on the leads 1A, 1B and1C made of a metal. Further, the light emitted from the LED units 3A, 3Band 3C toward one side in the z direction is efficiently reflectedtoward the other side in the z direction by the white support member 6filling the openings 11 a and 11 d formed in the leads 1A, 1B and 1C.

FIGS. 9 and 10 show an LED module according to a fifth embodiment of thepresent invention. The LED module A5 of this embodiment differs from theLED module Al in structure of the LED unit 3. In this embodiment, theLED unit 3 includes an LED chip 30 and a sub-mount substrate 33supporting the LED chip.

The LED chip 30 is made by forming a layer of a semiconductor materialsuch as gallium nitride on a surface of a substrate made of e.g.sapphire. The LED chip 30 emits blue light, green light, red light orthe like due to recombination of electrons and holes in an active layersandwiched between an n-type semiconductor layer and a p-typesemiconductor layer. In the LED chip 30, since the light emitted ishardly absorbed by the sapphire substrate, light is emitted in almostall directions. The LED chip 30 is provided with an electrode terminal31 electrically connected to the n-type semiconductor layer and anelectrode terminal 32 electrically connected to the p-type semiconductorlayer. As shown in FIG. 9, the LED chip 30 is so arranged as to includethe entirety of the opening 11 a, as viewed in the z direction.

The sub-mount substrate 33 is a transparent substrate made of e.g. Siand mounted on the lead 1 by using a transparent bonding material 4. Theupper end surface in the direction z is provided with an electrode pad34 at one end in the x direction and an electrode pad 35 at the otherend in the x direction. As shown in FIG. 9, the electrode pads 34 and 35are formed so as not to overlap the opening 11 a as viewed in the zdirection. The electrode pad 34 is electrically connected to thedie-bonding portion 11 via a wire 51. The electrode pad 35 iselectrically connected to the wire-bonding portion 21 via a wire 52.

As shown in FIG. 10, the LED chip 30 is mounted on the sub-mountsubstrate 33, with the electrode terminal 31 electrically connected tothe electrode pad 34 and the electrode terminal 32 electricallyconnected to the electrode pad 35. The electrode terminals 31 and 32 arebonded to the electrode pads 34 and 35 by e.g. eutectic bonding.

Since the sub-mount substrate 33 is mounted on the lead 1 made of ametal, heat generated during light emission of the LED chip 30 isreadily transmitted to the lead 1. Since the terminal portion 12 of thelead 1 is exposed to the outside of the support member 6, heattransferred to the lead 1 is readily released to the outside air. Thus,the LED module A5 exhibits high heat dissipation performance. Further,deterioration due to temperature rise of the LED chip 30 is prevented,so that reliability is enhanced.

Moreover, according to this embodiment, part of the light emitted fromthe LED chip 30 downward in the z direction passes through thetransparent sub-mount substrate 33 and is then reflected by the whitesupport member 6 filling the opening 11 a to travel upward in the zdirection. In this way, in the LED module A5, light traveling downwardin the z direction is efficiently turned into light traveling upward inthe z direction. Thus, the LED module A5 can utilize light from the LEDchip 30 with a high efficiency close to the efficiency provided when theLED unit 3 is placed on a white non-metal material, while exhibitinghigh heat dissipation performance by the use of the metal lead 1.

FIG. 11 shows an LED module according to a sixth embodiment of thepresent invention. The LED module A6 of this embodiment differs from theLED module A5 in the manner in which the LED unit 3 is mounted. Thestructures of other parts are the same as those of the LED module A5.Further, in this embodiment, the sub-mount substrate 33 is mounted onthe lead 1 by using a conductive bonding material 41 such as silverpaste.

In this embodiment, the lower end surface of the LED chip 30 in the zdirection is provided with an electrode terminal 31, which iselectrically connected to the p-type semiconductor layer, at one end inthe x direction and an electrode terminal 32, which is electricallyconnected to the n-type semiconductor layer, at the other end in the xdirection.

The sub-mount substrate 33 of this embodiment has a through-hole 33 afilled with an electric conductor 36, instead of having an electrode pad34. The electric conductor 36 is electrically connected to the lead 1via the bonding material 41. Because of this arrangement, the wire 51 isnot provided in this embodiment.

The LED chip 30 of this embodiment is mounted on the sub-mount substrate33, with the electrode terminal 31 electrically connected to theelectric conductor 36 and the electrode terminal 32 electricallyconnected to the electrode pad 35. The electrode pad 35 and thewire-bonding portion 21 are connected to each other via a wire 52.

As shown in FIG. 11, the bonding material 41 is formed so as not tooverlap the opening 11 a.

With the LED module A6 again, part of the light emitted from the LEDchip 30 downward in the z direction passes through the transparentsub-mount substrate 33 and is then reflected by the white support member6 filling the opening 11 a to travel upward in the z direction. In thisway, in the LED module A6, light traveling downward in the z directionis efficiently turned into light traveling upward in the z direction.Thus, the LED module A6 can utilize light from the LED chip 30 with ahigh efficiency close to the efficiency provided when the LED unit 3 isplaced on a white non-metal material, while exhibiting high heatdissipation performance by the use of the metal lead 1.

The LED module of the present invention is not limited to the foregoingembodiments. The specific structure of each part of the LED moduleaccording to the present invention can be varied in design in many ways.For instance, e.g. aluminum nitride maybe added as a heat dissipatingfiller to the bonding material 4 of the LED modules A1-A3. Enhancing theheat conductivity of the bonding material 4 promotes heat transfer fromthe LED unit 3 to the lead 1.

Although the openings 11 a, 11 b, 11 d are rectangular as viewed in thez direction in the foregoing embodiments, the openings may be circularor oval or have other polygonal shape.

Although the leads 1, 2, 1A, 1B, 1C, 2A, 2B and 2C are made of a copperplate plated with silver, other metals may be used to form the leads.

Although the support member 6 is made of a white resin in the foregoingembodiments, an LED module employing a white ceramic substrate similarlyto the conventional LED module X also provides the advantages of thepresent invention.

Although openings 11 a are provided in the LED modules A5 and A6,openings similar to the opening 11 b of the LED module A2 or similar tothe opening 11 c of the LED module A3 may be provided.

1-8. (canceled)
 9. A light-emitting module comprising: a first lead; asecond lead spaced apart from the first lead; an LED chip provided witha first electrode terminal and a second electrode terminal, the firstelectrode terminal being electrically connected to the first lead, thesecond electrode terminal being electrically connected to the secondlead via a wire; a white support member supporting the first lead andthe second lead and having a higher reflectivity than the first lead;and a bonding member for attaching the LED chip to the first lead, thebonding member being transparent with respect to light emitted from theLED chip; wherein the first lead includes a die-bonding portion having afirst surface and a second surface opposite to each other in a thicknessdirection, the LED chip being mounted on the first surface, the secondsurface being in contact with the support member, the die-bondingportion is formed with an opening extending through the die-bondingportion in the thickness direction, the support member includes aportion disposed within the opening, and at least a part of the portionof the support member disposed within the opening overlaps a part of theLED chip as viewed in the thickness direction.
 10. The light-emittingmodule according to claim 9, wherein at least a part of the openingoverlaps a part of the LED chip as viewed in the thickness direction.11. The light-emitting module according to claim 9, wherein the supportmember is made of a resin.
 12. The light-emitting module according toclaim 11, wherein the opening is entirely filled with the supportmember.
 13. The light-emitting module according to claim 10, wherein theopening is smaller in size than the LED chip as viewed in the thicknessdirection so that the entirety of the opening overlaps the LED chip. 14.The light-emitting module according to claim 10, wherein the opening hasa part which does not overlap the LED chip as viewed in the thicknessdirection.
 15. The light-emitting module according to claim 14, whereinthe LED chip includes two sides opposite to each other in the thicknessdirection, both the first electrode terminal and the second electrodeterminal being provided at one of the two sides, and wherein the openingincludes two ends spaced apart from each other in a directionperpendicular to a direction in which the wire extends, and one of thetwo ends does not overlap the LED chip as viewed in the thicknessdirection.
 16. The light-emitting module according to claim 13, whereinthe LED chip includes two sides opposite to each other in the thicknessdirection, the first electrode terminal being provided at one of the twosides, the second electrode terminal being provided at the other of thetwo sides.
 17. The light-emitting module according to claim 9, whereinthe first lead and the second lead include a surface plated with silver.18. The light-emitting module according to claim 9, wherein the bondingmember contains alumina nitride.
 19. The light-emitting module accordingto claim 9, wherein the LED chip includes a substrate and asemiconductor element provided on the substrate, the substrate beingmade of a material transparent with respect to light emitted from thesemiconductor element, the substrate being attached to the supportmember via the bonding member.
 20. The light-emitting module accordingto claim 9, wherein the support member comprises a ceramic substrate,and the first lead and the second lead comprise a wiring pattern formedon the ceramic substrate.